Copper thin film of alternating textures

Copper–titanium thin film interaction

Interaction between 5 lm thick copper and 50 nm thin titanium films was investigated as a function of annealing temperature and time using MeV He Rutherford backscattering, X-ray diffraction and dynamic Secondary Ion Mass Spectrometry. Samples were made by depositing 10 nm of titanium on a PECVD silicon oxynitride, followed by 50 nm of titanium nitride and 50 nm of titanium in the said order. I...

Fracture in a thin film of nanotwinned copper

Quantitative Modeling and Measurement of Copper Thin Film Adhesion

Numerous mechanisms have been identified as fundamental to the adhesion of thin metallic films. The primary mechanism is the thermodynamic work of adhesion of the interface, which in its most basic description is the difference between the surface energies of the two materials and that of the interface. This quantity is often described as leveraging the contributions of other mechanisms. One of...

Copper (II) oxide thin film for methanol and ethanol sensing

A nanostructured copper (II) oxide film deposited by reactive DC-magnetron sputtering technique, has been studied for static sensor response towards methanol and ethanol by operating temperature and analyte concentration modulations. The optimum operating temperature (Topt) for the sensing of methanol and ethanol is observed to be 350 ̊C and 400 ̊C, respectively. The maximum sensitivity observe...

Copper-Zinc-Tin-Sulfur Thin Film Using Spin-Coating Technology

Cu₂ZnSnS₄ (CZTS) thin films were deposited on glass substrates by using spin-coating and an annealing process, which can improve the crystallinity and morphology of the thin films. The grain size, optical gap, and atomic contents of copper (Cu), zinc (Zn), tin (Sn), and sulfur (S) in a CZTS thin film absorber relate to the concentrations of aqueous precursor solutions containing copper chloride...